HiSilicon
Chinese fabless semiconductor manufacturing company
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| April 2025 | HiSilicon announced the Ascend 920 AI chip, designed as a potential alternative to the NVIDIA H20 chip which was banned from selling to China in the same month. The chip is expected to be mass-produced in late 2025. |
| January 2025 | HiSilicon introduced the Kirin T80 (Hi6290V110) processor, which was first used in the Huawei MatePad 11.5 PaperMatte tablet. |
| December 2024 | HiSilicon is set to launch the Kirin 9020 SoC and Kirin T92 SoC for the Huawei MatePad Pro 13.2, featuring improved Taishan cores and Balong 6000 5G technology. |
| November 26 2024 | HiSilicon launched the Balong 6000 modem, which first appeared in the Huawei Mate 70 Pro. This modem is one of the first 3GPP Rel. 18 and 5.5G/5G-Advanced supporting modems in the world, offering advanced network capabilities including multi-mode support (2G/3G/4G/5G) and high-speed data transmission. |
| October 2024 | US government expanded export controls targeting semiconductor toolmakers like KLA Corporation, Lam Research, and Applied Materials. |
| September 2024 | HiSilicon plans to release the Kirin 9010E SoC for the Huawei Nova Flip and the Kirin T91 SoC for the Huawei MatePad Pro 12.2. |
| April 2024 | HiSilicon introduces the Kirin 9010L SoC for the Huawei Nova 12 Ultra Star Edition and the Kirin 9010W SoC for various devices. |
| February 2024 | HiSilicon launches the Kirin 9000S1 and Kirin 9010 SoCs with the Huawei Pura 70 series, featuring overclocked enhancements and a modified 2+6+4 core configuration. |
| January 2024 | HiSilicon releases the Kirin 9000W Wi-Fi only SoC for the Huawei MatePad Pro 13.2 Wi-Fi model, introducing the chip to global markets. |
| 2023 | The Kunpeng 950 server processor was scheduled for launch, representing HiSilicon's advanced computing technology in the server market. |
| September 2023 | HiSilicon debuts the Kirin 9000S SoC with the Huawei Mate 60, marking the first HiSilicon-developed SoCs manufactured in high volumes in mainland China by SMIC using 7nm technology. |
| September 25 2023 | HiSilicon launched the Kirin A2 SoC, featuring improved transmission speeds, Polar code technology for stable signals, 50% increased computing power performance, and Audio Vivid technology for wearable devices. |
| August 29 2023 | Huawei announced the first fully domestically fabricated chip, the Kirin 9000S, used in the Mate 60 Pro phablet series and MatePad 13.2 tablets. |
| 2022 | Lam Research and Applied Materials suspended sales and services to Chinese semiconductor companies. |
| 2022 | US government lobbied Dutch government to block ASML from selling older DUV lithography machines to China. |
| 2022 | US government banned NVIDIA H100 chips from sale to China, impacting AI chip market dynamics. |
| 2021 | Scheduled launch of the Kunpeng 930 processor, featuring 80 custom TaishanV120 cores built on TSMC's 5 nm process technology. |
| 2021 | HiSilicon releases a 4G version of the Kirin 9000, with the Balong modem limited via software to comply with the US government's ban on Huawei's 5G technologies. |
| January 2021 | HiSilicon released the Kirin 820E 5G processor, featuring a 3+3 core configuration with Cortex-A76 and Cortex-A55 cores, and Mali-G57 MP6 GPU, also using the Balong 5000 modem for 5G connectivity. |
| October 2020 | Introduction of the Kirin 9000L variant with a modified core configuration: 1+2+3 core setup, featuring a 22-core Mali-G78 GPU and Kirin Gaming+ 3.0 implementation. |
| October 2020 | HiSilicon launches the Kirin 9000, its first SoC based on 5 nm+ FinFET (EUV) TSMC technology, marking the first 5 nm SoC launched on the international market. The chip features an octa-core design with 15.3 billion transistors and advanced 5G connectivity. |
| October 2020 | HiSilicon releases the Kirin 990E 5G smartphone application processor with a slightly reduced GPU configuration (Mali-G76 MP14) compared to the standard 5G model. |
| September 15 2020 | Huawei announced it will stop producing Kirin chipsets due to United States trade restrictions on HiSilicon's supply chain. |
| April 2020 | HiSilicon introduced the Kirin 985 5G, its second 5G SoC based on 7 nm FinFET Technology, featuring a Big-Tiny Da Vinci NPU with 1x Da Vinci Lite and 1x Da Vinci Tiny components. |
| January 2020 | HiSilicon launched the Kirin 820 5G application processor, supporting both Non-Standalone (NSA) and Standalone (SA) 5G networks using the Balong 5000 modem with Sub-6 GHz capabilities. |
| 2019 | HiSilicon announced the Kunpeng 950, their sixth-generation server processor, marking a significant milestone in their processor development. |
| 2019 | HiSilicon announced the Kunpeng 930 server processor, their fifth-generation processor formerly known as Hi1630. |
| 2019 | HiSilicon launched the Kunpeng 920 processor, which features 32 to 64 custom TaiShan V110 cores and is manufactured using TSMC's 7 nm HPC process technology. |
| 2019 | Shanghai HiSilicon, a wholly-owned subsidiary of Huawei, was established. |
| October 2019 | HiSilicon launches the Kirin 990 5G smartphone application processor, which is their first 5G SoC based on TSMC 7 nm+ FinFET (EUV) technology, featuring Balong 5000 modem for Sub-6-GHz 5G networks. |
| October 2019 | HiSilicon introduces the Kirin 990 4G smartphone application processor, manufactured using TSMC 7 nm FinFET (DUV) technology, with a big.LITTLE CPU configuration and Mali-G76 MP16 GPU. |
| September 6 2019 | HiSilicon announced the Kirin A1 (Hi1132) System on Chip (SoC), designed for wearable devices with advanced Bluetooth 5.1 capabilities, a 356 MHz audio processor, and a Cortex-M7 microprocessor. |
| April 2019 | HiSilicon released the Kirin 8000 (Hi6290V110) smartphone application processor, manufactured using SMIC N+27 nm FinFET process, with an ARMv8.2-A architecture featuring a big.LITTLE configuration of 1 high-performance Cortex-A77 core, 3 mid-performance Cortex-A77 cores, and 4 energy-efficient Cortex-A55 cores. |
| April 2019 | HiSilicon introduced the Kirin 810 smartphone application processor, manufactured using 7 nm FinFET process, featuring a big.LITTLE architecture with 2 Cortex-A76 cores and 6 Cortex-A55 cores, and Mali-G52 MP6 GPU. |
| January 2019 | HiSilicon launched the Balong 5000, the world's first 7 nm TSMC 5G multi-mode chipset, which supported full NR TDD/FDD spectrum and offered advanced multi-mode (2G/3G/4G/5G) connectivity with groundbreaking network architecture and speed capabilities. |
| 2018 | US government began pressuring ASML Holding to prevent selling new EUV lithography machines to China. |
| 2018 | HiSilicon announced the Kunpeng 920 (formerly Hi1620), its fourth generation server processor, marking a significant milestone in the company's processor development. |
| October 2018 | HiSilicon launched the Kirin 980, its first SoC based on 7 nm FinFET technology, featuring a dual NPU developed in collaboration with Cambricon Technologies. |
| September 2018 | HiSilicon released the Kirin 710 smartphone application processor, manufactured using TSMC's 12nm FinFET process, featuring an ARMv8-A architecture with 4+4 cores (Cortex-A73 and Cortex-A53) and Mali-G51 MP4 GPU, targeting Q3 2018 sampling availability. |
| 2016 | HiSilicon's Kirin 960 chipset was rated as one of the 'best of Android 2016' in performance by Android Authority. |
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